Transport in thermal DIP pen nanolithography

Brent A. Nelson, Tanya L. Wright, William P. King, Paul E. Sheehan, Lloyd J. Whitman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publicationProceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications
PublisherAmerican Society of Mechanical Engineers
Pages125-126
Number of pages2
ISBN (Print)0791841774, 9780791841778
DOIs
StatePublished - Jan 1 2004
Event3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications - Pasadena, CA, United States
Duration: Sep 22 2004Sep 24 2004

Publication series

NameProceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications

Other

Other3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications
CountryUnited States
CityPasadena, CA
Period9/22/049/24/04

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Nelson, B. A., Wright, T. L., King, W. P., Sheehan, P. E., & Whitman, L. J. (2004). Transport in thermal DIP pen nanolithography. In Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications (pp. 125-126). [NANO2004-46074] (Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications). American Society of Mechanical Engineers. https://doi.org/10.1115/nano2004-46074