Transport in thermal DIP pen nanolithography

Brent A Nelson, Tanya L. Wright, William P. King, Paul E. Sheehan, Lloyd J. Whitman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermal dip pen nanolithography (tDPN), which uses atomic force microscope (AFM) cantilevers with integrated heaters, is described. In tDPN, a molecular ink with a melting temperature above ambient was selected and then coated onto the AFM tips. It was observed that at ambient temperature and at 57°C, there was no deposition, showing that the tip does not contaminate the surface at low temperatures. It was also observed that as the tip temperature reached 98°C, some deposition occurred, while at a tip temperature of 122°C, the octadecylphosphonic acid (OPA) became more mobile and a more robust deposition occurred.

Original languageEnglish (US)
Title of host publicationProceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications
Pages125-126
Number of pages2
StatePublished - 2004
Externally publishedYes
Event3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications - Pasadena, CA, United States
Duration: Sep 22 2004Sep 24 2004

Other

Other3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications
CountryUnited States
CityPasadena, CA
Period9/22/049/24/04

Fingerprint

Nanolithography
Microscopes
Temperature
Ink
Melting point
Acids
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Nelson, B. A., Wright, T. L., King, W. P., Sheehan, P. E., & Whitman, L. J. (2004). Transport in thermal DIP pen nanolithography. In Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications (pp. 125-126). [NANO2004-46074]

Transport in thermal DIP pen nanolithography. / Nelson, Brent A; Wright, Tanya L.; King, William P.; Sheehan, Paul E.; Whitman, Lloyd J.

Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications. 2004. p. 125-126 NANO2004-46074.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nelson, BA, Wright, TL, King, WP, Sheehan, PE & Whitman, LJ 2004, Transport in thermal DIP pen nanolithography. in Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications., NANO2004-46074, pp. 125-126, 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications, Pasadena, CA, United States, 9/22/04.
Nelson BA, Wright TL, King WP, Sheehan PE, Whitman LJ. Transport in thermal DIP pen nanolithography. In Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications. 2004. p. 125-126. NANO2004-46074
Nelson, Brent A ; Wright, Tanya L. ; King, William P. ; Sheehan, Paul E. ; Whitman, Lloyd J. / Transport in thermal DIP pen nanolithography. Proceedings of the 3rd ASME Integrated Nanosystems Conference - Design, Synthesis, and Applications. 2004. pp. 125-126
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