Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip

William P. King, Brent A Nelson, Tanya L. Wright, Paul A. Sheehan, Lloyd J. Whitman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The fabrication and use of a heated atomic force microscope (AFM) cantilevers for thermal dip pen nanolithography (tDPN) was investigated. A heated AFM cantilever was coated with ∼ 2 nm thickness octadecyl phosphonic acid, a small-molecule organic that melts at approximately 99°C. The AFM tip was scanning in contact with a mica substrate at four different locations and temperatures. The results showed that OPA was deposited from the cantilever tip only when the tip was hotter than the OPA melting temperature, and that the deposition rate is temperature-dependent.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Pages509-510
Number of pages2
Volume4
DOIs
StatePublished - 2004
Externally publishedYes
Event2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004 - Anaheim, CA, United States
Duration: Nov 13 2004Nov 19 2004

Other

Other2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004
CountryUnited States
CityAnaheim, CA
Period11/13/0411/19/04

Fingerprint

Soldering
Melting
Microscopes
Nanolithography
Mica
Deposition rates
Melting point
Scanning
Fabrication
Temperature
Molecules
Acids
Substrates

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

King, W. P., Nelson, B. A., Wright, T. L., Sheehan, P. A., & Whitman, L. J. (2004). Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip. In American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP (Vol. 4, pp. 509-510). [IMECE2004-59126] https://doi.org/10.1115/IMECE2004-59126

Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip. / King, William P.; Nelson, Brent A; Wright, Tanya L.; Sheehan, Paul A.; Whitman, Lloyd J.

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. Vol. 4 2004. p. 509-510 IMECE2004-59126.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

King, WP, Nelson, BA, Wright, TL, Sheehan, PA & Whitman, LJ 2004, Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip. in American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. vol. 4, IMECE2004-59126, pp. 509-510, 2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004, Anaheim, CA, United States, 11/13/04. https://doi.org/10.1115/IMECE2004-59126
King WP, Nelson BA, Wright TL, Sheehan PA, Whitman LJ. Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip. In American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. Vol. 4. 2004. p. 509-510. IMECE2004-59126 https://doi.org/10.1115/IMECE2004-59126
King, William P. ; Nelson, Brent A ; Wright, Tanya L. ; Sheehan, Paul A. ; Whitman, Lloyd J. / Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP. Vol. 4 2004. pp. 509-510
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