Initial results on the development of A new wafer inspection paradigm

Tarek A. El Doker, Josh King, David R Scott

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new paradigm for wafer inspection is being developed that would resolve many pending issues of -wafer inspection today. This paradigm integrates 1) a DRAM fabrication line simulation model, producing synthetic images of "Epical" wafer maps and associated defects to, 2) fuzzy clustering/declustering algorithms that identify various defects, and 3) a unique defect tracking mechanism to monitor patterns of defects across wafer maps. This approach holds promise for in-line process control by allowing for off-site analysis of fabrication line problems and unsupervised adaptation and optimization of application-specific inspection algorithms. The paper reports on the progress made towards the fulfilment of this paradigm.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Southwest Symposium on Image Analysis and Interpretation
Pages124-127
Number of pages4
Volume6
StatePublished - 2004
Event2004 IEEE Southwest Symposium on Image Analysis and Interpretation - Lake Tahoe, NV, United States
Duration: Mar 28 2004Mar 30 2004

Other

Other2004 IEEE Southwest Symposium on Image Analysis and Interpretation
CountryUnited States
CityLake Tahoe, NV
Period3/28/043/30/04

    Fingerprint

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition

Cite this

El Doker, T. A., King, J., & Scott, D. R. (2004). Initial results on the development of A new wafer inspection paradigm. In Proceedings of the IEEE Southwest Symposium on Image Analysis and Interpretation (Vol. 6, pp. 124-127)