Direct deposition of electronic materials with thermal DPN

P. E. Sheehan, M. Yang, A. R. Laracuente, W. P. King, L. J. Whitman, Brent A Nelson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In recent years there has been a significant effort to improve or augment lithographic techniques for electronic device fabrication. Although improvements in ultimate resolution have been a central goal, other goals have also been pursued that may be important avenues to advance device fabrication. These alternate objectives include reduction of toxic by-products ("green chemistry"), integration of disparate materials into a single structure (e.g., organic and inorganic), and production or prototyping of low numbers of integrated circuits at relatively low unit cost. Progress towards all these goals is found in a new lithographic technique, thermal Dip Pen Nanolithography (tDPN). In tDPN (Figure 1), an atomic force microscope (AFM) cantilever is custom fabricated to include a heater directly above the tip. The tip is then coated with an "ink" that is solid at room temperature but that can be melted by the integrated heater. When the ink is melted, it flows onto the surface and solidifies, thereby allowing arbitrary patterns to be written.

Original languageEnglish (US)
Title of host publicationDigital Fabrication 2005 - Final Program and Proceedings
Pages52-54
Number of pages3
StatePublished - 2005
Externally publishedYes
EventDigital Fabrication 2005 - Baltimore, MD, United States
Duration: Sep 18 2005Sep 22 2005

Other

OtherDigital Fabrication 2005
CountryUnited States
CityBaltimore, MD
Period9/18/059/22/05

Fingerprint

Nanolithography
Ink
Fabrication
Byproducts
Integrated circuits
Microscopes
Costs
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sheehan, P. E., Yang, M., Laracuente, A. R., King, W. P., Whitman, L. J., & Nelson, B. A. (2005). Direct deposition of electronic materials with thermal DPN. In Digital Fabrication 2005 - Final Program and Proceedings (pp. 52-54)

Direct deposition of electronic materials with thermal DPN. / Sheehan, P. E.; Yang, M.; Laracuente, A. R.; King, W. P.; Whitman, L. J.; Nelson, Brent A.

Digital Fabrication 2005 - Final Program and Proceedings. 2005. p. 52-54.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sheehan, PE, Yang, M, Laracuente, AR, King, WP, Whitman, LJ & Nelson, BA 2005, Direct deposition of electronic materials with thermal DPN. in Digital Fabrication 2005 - Final Program and Proceedings. pp. 52-54, Digital Fabrication 2005, Baltimore, MD, United States, 9/18/05.
Sheehan PE, Yang M, Laracuente AR, King WP, Whitman LJ, Nelson BA. Direct deposition of electronic materials with thermal DPN. In Digital Fabrication 2005 - Final Program and Proceedings. 2005. p. 52-54
Sheehan, P. E. ; Yang, M. ; Laracuente, A. R. ; King, W. P. ; Whitman, L. J. ; Nelson, Brent A. / Direct deposition of electronic materials with thermal DPN. Digital Fabrication 2005 - Final Program and Proceedings. 2005. pp. 52-54
@inproceedings{6dbc0bf26f074c889f17cd740ef4ead0,
title = "Direct deposition of electronic materials with thermal DPN",
abstract = "In recent years there has been a significant effort to improve or augment lithographic techniques for electronic device fabrication. Although improvements in ultimate resolution have been a central goal, other goals have also been pursued that may be important avenues to advance device fabrication. These alternate objectives include reduction of toxic by-products ({"}green chemistry{"}), integration of disparate materials into a single structure (e.g., organic and inorganic), and production or prototyping of low numbers of integrated circuits at relatively low unit cost. Progress towards all these goals is found in a new lithographic technique, thermal Dip Pen Nanolithography (tDPN). In tDPN (Figure 1), an atomic force microscope (AFM) cantilever is custom fabricated to include a heater directly above the tip. The tip is then coated with an {"}ink{"} that is solid at room temperature but that can be melted by the integrated heater. When the ink is melted, it flows onto the surface and solidifies, thereby allowing arbitrary patterns to be written.",
author = "Sheehan, {P. E.} and M. Yang and Laracuente, {A. R.} and King, {W. P.} and Whitman, {L. J.} and Nelson, {Brent A}",
year = "2005",
language = "English (US)",
isbn = "0892082585",
pages = "52--54",
booktitle = "Digital Fabrication 2005 - Final Program and Proceedings",

}

TY - GEN

T1 - Direct deposition of electronic materials with thermal DPN

AU - Sheehan, P. E.

AU - Yang, M.

AU - Laracuente, A. R.

AU - King, W. P.

AU - Whitman, L. J.

AU - Nelson, Brent A

PY - 2005

Y1 - 2005

N2 - In recent years there has been a significant effort to improve or augment lithographic techniques for electronic device fabrication. Although improvements in ultimate resolution have been a central goal, other goals have also been pursued that may be important avenues to advance device fabrication. These alternate objectives include reduction of toxic by-products ("green chemistry"), integration of disparate materials into a single structure (e.g., organic and inorganic), and production or prototyping of low numbers of integrated circuits at relatively low unit cost. Progress towards all these goals is found in a new lithographic technique, thermal Dip Pen Nanolithography (tDPN). In tDPN (Figure 1), an atomic force microscope (AFM) cantilever is custom fabricated to include a heater directly above the tip. The tip is then coated with an "ink" that is solid at room temperature but that can be melted by the integrated heater. When the ink is melted, it flows onto the surface and solidifies, thereby allowing arbitrary patterns to be written.

AB - In recent years there has been a significant effort to improve or augment lithographic techniques for electronic device fabrication. Although improvements in ultimate resolution have been a central goal, other goals have also been pursued that may be important avenues to advance device fabrication. These alternate objectives include reduction of toxic by-products ("green chemistry"), integration of disparate materials into a single structure (e.g., organic and inorganic), and production or prototyping of low numbers of integrated circuits at relatively low unit cost. Progress towards all these goals is found in a new lithographic technique, thermal Dip Pen Nanolithography (tDPN). In tDPN (Figure 1), an atomic force microscope (AFM) cantilever is custom fabricated to include a heater directly above the tip. The tip is then coated with an "ink" that is solid at room temperature but that can be melted by the integrated heater. When the ink is melted, it flows onto the surface and solidifies, thereby allowing arbitrary patterns to be written.

UR - http://www.scopus.com/inward/record.url?scp=29844438082&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=29844438082&partnerID=8YFLogxK

M3 - Conference contribution

SN - 0892082585

SP - 52

EP - 54

BT - Digital Fabrication 2005 - Final Program and Proceedings

ER -