Direct deposition of continuous metal nanostructures by thermal dip-pen nanolithography

Brent A Nelson, W. P. King, A. R. Laracuente, P. E. Sheehan, L. J. Whitman

Research output: Contribution to journalArticle

93 Citations (Scopus)

Abstract

We describe the deposition of continuous metal nanostructures onto glass and silicon using a heated atomic force microscope cantilever. Like a miniature soldering iron, the cantilever tip is coated with indium metal, which can be deposited onto a surface forming lines of a width less than 80 nm. Deposition is controlled using a heater integrated into the cantilever. When the cantilever is unheated, no metal is deposited from the tip, allowing the writing to be registered to existing features on the surface. We demonstrate direct-write circuit repair by writing an electrical connection between two metal electrodes separated by a submicron gap.

Original languageEnglish (US)
Article number033104
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Volume88
Issue number3
DOIs
StatePublished - 2006
Externally publishedYes

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pens
metals
soldering
heaters
indium
microscopes
iron
electrodes
glass
silicon

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Direct deposition of continuous metal nanostructures by thermal dip-pen nanolithography. / Nelson, Brent A; King, W. P.; Laracuente, A. R.; Sheehan, P. E.; Whitman, L. J.

In: Applied Physics Letters, Vol. 88, No. 3, 033104, 2006, p. 1-3.

Research output: Contribution to journalArticle

Nelson, Brent A ; King, W. P. ; Laracuente, A. R. ; Sheehan, P. E. ; Whitman, L. J. / Direct deposition of continuous metal nanostructures by thermal dip-pen nanolithography. In: Applied Physics Letters. 2006 ; Vol. 88, No. 3. pp. 1-3.
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