A method of evaluating the cooling performance of electronic equipment via a porous media approach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A method of applying the porous media approach to evaluate the cooling performance of electronic equipment is proposed. A theoretical account is provided to show the simplifying aspects of adopting such an approach. Ways to plan experiments in order to evaluate the effective properties related to a particular electronic component are also demonstrate. The latter is an essential component in the application of the porous media approach.

Original languageEnglish (US)
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
EditorsK. Ramakrishna, B.G. Sammakia, J.R. Culham, Y.K. Joshi, J. Hock-Lye Pang, K. Jonnalagadda, S. Tonapi, G. Refai-Ahmed, T.Y. Tom Lee, D.W. Copeland, M.J. Ellesworth Jr.
Pages672-678
Number of pages7
Volume1
StatePublished - 2004
EventITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

Other

OtherITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
CountryUnited States
CityLas Vegas, NV
Period6/1/046/4/04

Fingerprint

Porous materials
Electronic equipment
Cooling
Experiments

Keywords

  • Cooling of Electronic Equipment
  • Cooling Performance
  • Porous Media Approach

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Vadasz, P. (2004). A method of evaluating the cooling performance of electronic equipment via a porous media approach. In K. Ramakrishna, B. G. Sammakia, J. R. Culham, Y. K. Joshi, J. Hock-Lye Pang, K. Jonnalagadda, S. Tonapi, G. Refai-Ahmed, T. Y. Tom Lee, D. W. Copeland, ... M. J. Ellesworth Jr. (Eds.), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (Vol. 1, pp. 672-678)

A method of evaluating the cooling performance of electronic equipment via a porous media approach. / Vadasz, Peter.

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. ed. / K. Ramakrishna; B.G. Sammakia; J.R. Culham; Y.K. Joshi; J. Hock-Lye Pang; K. Jonnalagadda; S. Tonapi; G. Refai-Ahmed; T.Y. Tom Lee; D.W. Copeland; M.J. Ellesworth Jr. Vol. 1 2004. p. 672-678.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vadasz, P 2004, A method of evaluating the cooling performance of electronic equipment via a porous media approach. in K Ramakrishna, BG Sammakia, JR Culham, YK Joshi, J Hock-Lye Pang, K Jonnalagadda, S Tonapi, G Refai-Ahmed, TY Tom Lee, DW Copeland & MJ Ellesworth Jr. (eds), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. vol. 1, pp. 672-678, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States, 6/1/04.
Vadasz P. A method of evaluating the cooling performance of electronic equipment via a porous media approach. In Ramakrishna K, Sammakia BG, Culham JR, Joshi YK, Hock-Lye Pang J, Jonnalagadda K, Tonapi S, Refai-Ahmed G, Tom Lee TY, Copeland DW, Ellesworth Jr. MJ, editors, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 1. 2004. p. 672-678
Vadasz, Peter. / A method of evaluating the cooling performance of electronic equipment via a porous media approach. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. editor / K. Ramakrishna ; B.G. Sammakia ; J.R. Culham ; Y.K. Joshi ; J. Hock-Lye Pang ; K. Jonnalagadda ; S. Tonapi ; G. Refai-Ahmed ; T.Y. Tom Lee ; D.W. Copeland ; M.J. Ellesworth Jr. Vol. 1 2004. pp. 672-678
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